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1.Diagnosing a DS1 runs board-level hardware tests on the DS1 interface.
诊断 DS1 就是对 DS1 接口运行电路级的硬件测试。收藏指正
2.As the developing of IC design and manufacture process, the board level system is integrated into a chip. SystemOnChip ( SoC) is becoming the primary trend.
集成电路制造工艺水平和设计水平发展到今天,人们已经将原先的级系统集成在一个芯片上,系统芯片(SystemOnChip,简称SoC)逐渐成为集成电路设计的主流发展趋势。收藏指正
3.The results show that the viscoelasticity of PCB and its size have distinct influence on dynamic properties of PCB under board-level drop impact.
结果表明,电路的黏性系数和尺寸对的动力学特性有显著影响。收藏指正
4.Leaded and lead-free BGA (ball grid array) components were tested in board level drop test defined in the JEDEC (Joint Electron Device Engineering Council) standard.
按照JEDEC标准级跌落实验的要求测试了有铅和无铅焊点的球栅阵列封装。收藏指正
5.The simulation and the board level test result indicate that this SSM design method is correct and easy to realize, which also prove this SSM processing has a good performance.
仿真和调试结果表明了该SSM设计方法正确和易实现性,也验证了该SSM良好的性能。收藏指正
6.The corrections to the concept that I/O CHRDY signal of XT and AT bus must be driven by open-cllector (OC) gate are given. The necessary and sufficient condition for substituting OC gate for tristate logic (TSL) gate is described. The substitution method is characterized by higher reliability and better ordered board level routing.
对XT及AT总线的I/OCHRDY信号必须采用集电极开路门(OC门)驱动的说法进行了更正,指出了用三态门(TSL门)代替OC门的充要条件,TSL门代替OC门有助于级布局布线的简明整洁,提高可靠性,并在FPGA内进行了逻辑实现,逻辑系统运行无误。收藏指正
7.When condole of PVC of choose and buy carries profile on the head, besides should ask for qualitative check report and product to detect to agency besides certificate of approval, can quality of range estimation exterior, board face should level off is smooth, flawless, without knock against, can tear open outfit freely, exterior luster does not have nick, the knock that use a hand board face sound is ringing.
选购PVC吊顶型材时,除了要向经销商索要质检报告和产品检测合格证之外,可以目测外观质量,面应平整光滑,无裂纹,无磕碰,能拆装自如,表面有光泽无划痕,用手敲击面声音清脆。收藏指正
8.In order to prepare production of high level pipe steel and cold rolling board, through analyzing clean level of Q235B steel that been produced by process of 210t top bottom double blowing convert - LF refining - CSP continuous casting - rolling, the paper puts forward controlling direction of clean steel.
为生产高级别管线钢和冷轧钢作准备,通过分析210吨顶底复吹转炉-LF炉精炼-连铸(CSP)-轧制工艺流程生产Q235B钢的洁净度水平,提出了CSP生产钢的洁净度工艺控制方向。收藏指正
9.With reinforced concrete prefab humidity of the air inside the modern building that board lid becomes greatly under normal level, differ with desert very few.
用钢筋水泥预制盖成的现代化大楼内空气湿度大大低于正常标准,与沙漠相差无几。收藏指正
10.Use electrical lift on the feeding table. Top of the board and feeder are maintain at the same level, easy for feeding.
送纸台采用电动升降装置,使纸顶面与进纸口保持同一高度,便利于送纸。收藏指正
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