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1.The diffusion mechanism of boron in γFe B system and TLP diffusion bonding area of G128 alloys is discussed,and their diffusion coefficient and activation energy are calculated.
讨论硼在γFe B系统以及GH12 8合金TLP扩散连接区中的扩散机制 ,计算了它们的扩散系数与激活能 .收藏指正
2.Lateral Diffusion of Boron and Phosphorus in Silicon and It Leads to Problem of Failure for CMOS LSI
硅中硼磷的横向扩散及其引起的CMOS LSI失效问题收藏指正
3.Depending on the temperature in the diffusion area, the dip diffusion treatments of sawn timber with saturated boron solutions got good results in 6～8 weeks.
依据扩散区的温度，用饱和硼酸溶液对板材进行浸渍—扩散处理6～8周，获得很好的效果；收藏指正
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