encapsulating compound
2.Low viscosity, Excellent electrical properties, Used extensively as a high voltage potting compound as well as an encapsulating compound for delicate circuitry, Can be used with various curing agents, thus varying pot life, cure time, mix ratios and cure conditions.
3.Multi-purpose casting/encapsulating, potting and sealing compound, used successfully to protect electronic components, assemblies and delicate systems, Exhibits excellent electrical properties, low temperature flexibility and high temperature stability, A variety of catalysts are available for different cure situations.
4.Low cost, easy to use room temperature curing epoxy potting and casting compound, with a mix ratio of 1 to 1 by volume, the cured epoxy is a tough rigid plastic that is highly suited to most electrical or electronic potting and encapsulating applications.
