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1.Also, considering the disturbance action of solid grain to boundary layer, disturbance factor is cited.
又考虑到固体颗粒对边界层的扰动作用，引入了扰动因子。收藏指正
2.In B-doped Ni_3Al alloys it isshown that close to the grain boundary there exists a thin slip transition region,within which slip lines are reoriented or other slip systems are operated to producea local strain accommodation and to relax the stress concentration at grain bound-aries.
研究结果表明,在含硼Ni_3Al合金的晶界附近存在一个过渡滑移区,该区域中滑移线重新取向或其它滑移系开动,从而产生了局部应变调节并使晶界应力集中松弛。收藏指正
3.After adding element Al, Nd 2Fe 15 Al 2 phases segregate near to the grain boundary of the magnetic Nd 2Fe 14 B phase, which leads to the improvement of coercivity of magnets.
对于晶间添加Al元素的磁体 ,Al溶入晶间形成Nd2 Fe15Al2 相弥散地分布在晶界上 ,这有益于磁体矫顽力的提高 ;收藏指正
4.A simplified theoretical model is used to analyze the eflect of the grain boundary phases with bw oxygen ion conductivity on the EMF output of the ZrO2 oxygen sensor, the analysises show mat the grain boundary phases cause the EMF drill in orygen sensors. Finally, the methods to overcome the disadvantage of the grain boundary phases are put forward.
还用简化了的理论模型分析了低氧离子导电性的晶界相对ZrO_2氧传感器的输出电势的影响,分析表明,这种晶界相是造成ZrO_2氧传感器电势漂移的原因,最后,提出了克服晶界相不利影响的方法.收藏指正
5.Main deforming mechanism for magnesium superplasticity was still grain boundary sliding(GBS),which ought to be accommo dated by additional deforming mechanism when stress concentration occurred at triangular grain bound aries junction,or at the interface between the strengthening phase and the matri x in magnesium-based composites.
镁合金超塑性变形的主要机制仍然是晶界滑移,但晶界滑移总会在晶界三叉区或材料增强相与基体的相界处产生应力集中,使晶界滑移受到阻碍,这就需要有另外的协调机制来协调晶界进一步滑移。收藏指正
6.On the basis of emphatic analysis of the effect on the changes of system energy by the anisotropy of grain boundary energies and mobilities,this paper presents the basic methods for simulating abnormal growth. It provides an important idea to solve the problem of how to introduce the complexity of growth environment to the growth model and simulate grain growth further.
本文在重点分析由于晶界能和迁移率的各向异性引起体系能量变化的基础上，介绍模拟异常晶粒生长的基本方法，为解决如何将实际生长环境复杂性引入生长模型中及如何进一步模拟生长的问题提供重要思路。收藏指正
7.The electron backscatter diffraction technique (EBSD) has been used to measure the microstructure of reactive ion etched(RIE) Al and damascene Cu interconnects, including the grain size, grain orientation and grain boundary characteristics.
利用电子背散射衍射(EBSD)技术,测量了由反应离子刻蚀工艺(RIE)制备的Al互连线和大马士革工艺(Damascene)制备的Cu互连线的显微结构,包括晶粒尺寸、晶体学取向和晶界特征.收藏指正
8.After crystallized at 750℃ for 30 min, all grains grow up to the size of 20 - 80 nm, the grain boundary is clear and no interface phase, and the amorphous regions are hardly found.
快淬薄带经750℃晶化30 min后晶粒尺寸基本分布在20-80 nm之间,晶粒间直接接触,晶界光滑,没有明显的界面相存在,非晶区已基本消失;收藏指正
9.The results also show that the disordered region located at the ferroelectric domain boundary is about several to tens angstrom along the {001} lattice and the interface of core-shell is different from the general grain boundary and the domain boundary.
研究结果表明,壳-芯边界不同于通常晶粒边界结构,而在铁电畴的畴界处,存在一维方向几埃到数十埃的原子紊乱过渡区。收藏指正
10.Significant changes in microstructure and grain boundary character distributions were observed,which are attributed as the major cause for failure of the ROF internal cover due to very high temperature service conditions.
研究结果表明,服役前后YUS701奥氏体不锈钢ROF内罩在显微组织和晶界特征分布上有明显的差异,这种差异是ROF内罩超高温运行失效的重要原因。收藏指正
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