optical pressing
1.This paper also focus on introduction of various ways and methods of Flip Chip Bonding technology, which is mainly comprised of the following methods:thermal-pressing FCB,thermal supersonic FCB, reflow FCB(C4), epoxy resins optical-solidifying FCB, anisotropic electric polymer FCB, direct chip attaching(DCA), bump preparation through multi-layer substrate Flip impaction technology (B~2 it+FCA), and so on.
