refined lead
2.The results show that Zn and Ag ? Cu can form the AgZn and CuZn3 compound and the microstructure of Sn3.5Ag0.5Cu solder is refined at the same time. Morever,the wettability of the Sn3.5Ag0.5Cu lead-free solder is reduced and its tension strength is improved by adding elements Zn in Sn3.5Ag0.5Cu solder.

