1.On tin-plated copper substrate,the best wettability(the wetting angle is 12°) can be got when organic halide and inorganic halide activated rosinflux(No.6 flux) are matched with Sn-9Zn solder,close to the wettability of Sn-37Pb solder.
2.Among the three kinds of experimental fluxes the water soluble YH-61 flux is the best flux for Ni-P alloy film, but rosin fluxes of nonactive and modified by bromo-salicylic acid are not suitable for soldering of Ni-P alloy film.
