silicon stack
1.Performance for a piezoresistive transducer pressure sensor to thermal and pressure environments can be predicted by finite element method.A simplified 1/8 model,considering silicon dioxide and nitride process as well as stack anodic bonding and adhesive bonding processes,was developed.The FEM results were found to be comparable to experimental data.Case studies suggested that Pyrex stack induces certain amount of non-linearity,while it isolates hard epoxy nonlinear effect.Flexible epoxy bonding or soft adhesive bonding is preferred to the packaging process.The viscoelasticity and viscoplasticity of bonding material will result in hysteresis and drift errors to sensor output.However,soft adhesive s influence on sensor can be ignored under relative stable environments.More over,detailed design and process information will help to improve modeling application.
