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1.Flush the line before installing the unit to remove any solder, flux or pipe chips. Clean the strainer every six months or as conditions require.
在安装管接头之前要冲洗管线,清除任何焊料、焊剂或管道碎片。每六个月或根据需要清洗过滤器一次。收藏指正
2.Some modifications are required to accommodate the larger ball size of the bottom CSP as well as the use of solder paste in addition to flux.
为适应底部CSP较大的球体尺寸及使用焊膏和助焊剂,对上述技术必须进行某些改动。收藏指正
3.Flux: The material used to remove oxides from metal surfaces and enable wetting of the metal with solder.
助焊剂:用于除去金属表面氧化物并使焊料能润湿金属表面的材料。收藏指正
4.On tin-plated copper substrate,the best wettability(the wetting angle is 12°) can be got when organic halide and inorganic halide activated rosin flux(No.6 flux) are matched with Sn-9Zn solder,close to the wettability of Sn-37Pb solder.
在镀锡铜片上,有机卤化物+无机卤化物活性剂松香焊剂(#6焊剂)匹配Sn-9Zn焊料获得最佳的润湿性(润湿角为12°),接近Sn-37Pb焊料的润湿性。收藏指正
5.The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on.
分析表明:相关的影响因素主要包括合金的组成、纯度和化学均匀性;母材的成分、性质和表面的洁净度;液态焊料的表面张力;钎焊温度、气氛、助焊剂的活性;液态焊料表面膜的组成、结构和性能等。收藏指正
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